Product Details
Product Features
1. High flatness and parallelism;
2. Compact and uniform microstructure with high strength;
3. Good permeability and uniform adsorption affinity;
4. Dressing easily.
Processing Objects
2, 3, 4, 5, 6, 8, and 12inch semiconductor wafer.
Matching Machine
wafer grinder, dicing machine, and cleaning machine, etc.
Specification
FAQ
1. Do you have QC?
Yes, we have strict quality control, and then you don't have to worry about the quality of our products.
2. How about your service?
We are always trying our best to provide better services with every customer. If you have any question, please feel free to contact me at any time.
3. Can I get samples from your company?
Yes, you can, but you need to pay for the samples and the freight.
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